Articles | Volume 14, issue 1
https://doi.org/10.5194/jsss-14-89-2025
https://doi.org/10.5194/jsss-14-89-2025
Regular research article
 | 
27 May 2025
Regular research article |  | 27 May 2025

Tailored measurement setup for the contactless characterization of MEMS resonators at the wafer level

Dominik Huber, Michael Schneider, Paul Fulmek, Georg Pfusterschmied, and Ulrich Schmid

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Short summary
Photo-thermal actuation and laser Doppler vibrometry enable fast, contactless characterization of MEMS (microelectromechanical system) resonators already before electrical connections are made. This paper details a tailored setup combining a precision stage, vacuum chamber, laser diode, and vibrometer to analyze silicon MEMS devices on a wafer level. Tests reveal how silicon device layer thickness affects resonance frequency and identify dominant loss mechanisms in different vibrational modes.
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