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Journal of Sensors and Sensor Systems An open-access peer-reviewed journal
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Volume 4, issue 1
J. Sens. Sens. Syst., 4, 45–52, 2015
https://doi.org/10.5194/jsss-4-45-2015
© Author(s) 2015. This work is distributed under
the Creative Commons Attribution 3.0 License.
J. Sens. Sens. Syst., 4, 45–52, 2015
https://doi.org/10.5194/jsss-4-45-2015
© Author(s) 2015. This work is distributed under
the Creative Commons Attribution 3.0 License.

Regular research article 05 Feb 2015

Regular research article | 05 Feb 2015

Investigations into packaging technology for membrane-based thermal flow sensors

G. Dumstorff, E. Brauns, and W. Lang G. Dumstorff et al.
  • Institute of Microsensors, -actuators, and -systems (IMSAS), Microsystems Center Bremen, University of Bremen, Bremen, Germany

Abstract. A new packaging method to mount a membrane-based thermal flow sensor, flush with the surface, is presented. Therefore, a specific design for the housing is shown, which is also adaptable to other conditions. It has been experimentally shown that it is important to mount the sensor flush with the surface. In addition, the experimental results are discussed. If a membrane-based thermal flow sensor is not mounted flush with the surface, vortices can occur (depending on velocity and fluid properties) or the reduction in the channel cross section plus a decrease in sensitivity have to be taken into account.

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A new packaging method to mount a membrane-based thermal flow sensor, flush with the surface, is presented. Therefore, a specific design for the housing is shown that is also adaptable to other conditions. It has been experimentally shown that it is important to mount the sensor flush with the surface. If not, vortices can occur (depending on velocity and the fluid properties) or the reduction of the channel cross section plus a decrease in sensitivity have to be taken into account.
A new packaging method to mount a membrane-based thermal flow sensor, flush with the surface, is...
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