Investigations into packaging technology for membrane-based thermal flow sensors

Dumstorff, G.; Brauns, E.; Lang, W.

doi:https://doi.org/10.5194/jsss-4-45-2015

Articles | Volume 4, issue 1

https://doi.org/10.5194/jsss-4-45-2015

© Author(s) 2015. This work is distributed under
the Creative Commons Attribution 3.0 License.

https://doi.org/10.5194/jsss-4-45-2015

© Author(s) 2015. This work is distributed under
the Creative Commons Attribution 3.0 License.

Articles | Volume 4, issue 1

Regular research article

|

05 Feb 2015

Regular research article |

| 05 Feb 2015

Investigations into packaging technology for membrane-based thermal flow sensors

G. Dumstorff, E. Brauns, and W. Lang

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Views and downloads (calculated since 05 Feb 2015)

Month	HTML	PDF	XML	Total
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Mar 2015	5	7	1	13
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May 2015	5	8	2	15
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Jan 2024	3	2	0	5
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Cumulative views and downloads (calculated since 05 Feb 2015)

Month	HTML	PDF	XML	Total
Feb 2015	13	24	3	40
Mar 2015	5	7	1	13
Apr 2015	11	8	1	20
May 2015	5	8	2	15
Jun 2015	22	3	0	25
Jul 2015	20	8	1	29
Aug 2015	11	9	4	24
Sep 2015	7	5	2	14
Oct 2015	13	4	2	19
Nov 2015	10	6	0	16
Dec 2015	5	6	1	12
Jan 2016	9	8	2	19
Feb 2016	4	12	1	17
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Apr 2016	6	2	0	8
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Feb 2024	4	6	1	11
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Cited

Latest update: 23 Apr 2024

Short summary

A new packaging method to mount a membrane-based thermal flow sensor, flush with the surface, is presented. Therefore, a specific design for the housing is shown that is also adaptable to other conditions. It has been experimentally shown that it is important to mount the sensor flush with the surface. If not, vortices can occur (depending on velocity and the fluid properties) or the reduction of the channel cross section plus a decrease in sensitivity have to be taken into account.

Investigations into packaging technology for membrane-based thermal flow sensors

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Cited

5 citations as recorded by crossref.