Journal of Sensors and Sensor Systems
Journal of Sensors and Sensor Systems
JSSS
Articles | Volume 4, issue 1
Articles | Volume 4, issue 1
https://doi.org/10.5194/jsss-4-45-2015
© Author(s) 2015. This work is distributed under
the Creative Commons Attribution 3.0 License.
https://doi.org/10.5194/jsss-4-45-2015
© Author(s) 2015. This work is distributed under
the Creative Commons Attribution 3.0 License.
Articles | Volume 4, issue 1
Regular research article
 | 
05 Feb 2015
Regular research article |  | 05 Feb 2015

Investigations into packaging technology for membrane-based thermal flow sensors

G. Dumstorff, E. Brauns, and W. Lang

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Latest update: 03 Jul 2024
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Short summary
A new packaging method to mount a membrane-based thermal flow sensor, flush with the surface, is presented. Therefore, a specific design for the housing is shown that is also adaptable to other conditions. It has been experimentally shown that it is important to mount the sensor flush with the surface. If not, vortices can occur (depending on velocity and the fluid properties) or the reduction of the channel cross section plus a decrease in sensitivity have to be taken into account.
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