Journal of Sensors and Sensor Systems
Journal of Sensors and Sensor Systems
JSSS
Articles | Volume 11, issue 1
Articles | Volume 11, issue 1
https://doi.org/10.5194/jsss-11-83-2022
© Author(s) 2022. This work is distributed under
the Creative Commons Attribution 4.0 License.
https://doi.org/10.5194/jsss-11-83-2022
© Author(s) 2022. This work is distributed under
the Creative Commons Attribution 4.0 License.
Articles | Volume 11, issue 1
Regular research article
 | 
23 Mar 2022
Regular research article |  | 23 Mar 2022

Assembly and interconnection technology for high-temperature bulk acoustic wave resonators

Fabian Kohler, Monika Farina, Michal Schulz, Holger Fritze, and Jürgen Wilde

Viewed

Total article views: 940 (including HTML, PDF, and XML)
HTML PDF XML Total BibTeX EndNote
698 198 44 940 28 27
  • HTML: 698
  • PDF: 198
  • XML: 44
  • Total: 940
  • BibTeX: 28
  • EndNote: 27
Views and downloads (calculated since 23 Mar 2022)
Cumulative views and downloads (calculated since 23 Mar 2022)

Viewed (geographical distribution)

Total article views: 890 (including HTML, PDF, and XML) Thereof 890 with geography defined and 0 with unknown origin.
Country # Views %
  • 1
1
 
 
 
 

Cited

Latest update: 13 Dec 2024
Download
Short summary
This work shows a possibility of assembly and connection technology for use under high temperatures up to 1000 °C. A packaging concept was developed, and all the necessary material and joining technologies have been verified to be suitable for use at 1000 °C. A working sensor was built and measured in comparison to the resonator alone. All packaging materials and structures were measured electrically and dielectrically. Equivalent circuits for the packages up to 2 MHz and 1000 °C are available.
Read more