Journal of Sensors and Sensor Systems
Journal of Sensors and Sensor Systems
JSSS
Articles | Volume 11, issue 1
Articles | Volume 11, issue 1
https://doi.org/10.5194/jsss-11-83-2022
© Author(s) 2022. This work is distributed under
the Creative Commons Attribution 4.0 License.
https://doi.org/10.5194/jsss-11-83-2022
© Author(s) 2022. This work is distributed under
the Creative Commons Attribution 4.0 License.
Articles | Volume 11, issue 1
Regular research article
 | 
23 Mar 2022
Regular research article |  | 23 Mar 2022

Assembly and interconnection technology for high-temperature bulk acoustic wave resonators

Fabian Kohler, Monika Farina, Michal Schulz, Holger Fritze, and Jürgen Wilde

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Latest update: 20 Nov 2024
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Short summary
This work shows a possibility of assembly and connection technology for use under high temperatures up to 1000 °C. A packaging concept was developed, and all the necessary material and joining technologies have been verified to be suitable for use at 1000 °C. A working sensor was built and measured in comparison to the resonator alone. All packaging materials and structures were measured electrically and dielectrically. Equivalent circuits for the packages up to 2 MHz and 1000 °C are available.
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