Articles | Volume 11, issue 1
https://doi.org/10.5194/jsss-11-83-2022
https://doi.org/10.5194/jsss-11-83-2022
Regular research article
 | 
23 Mar 2022
Regular research article |  | 23 Mar 2022

Assembly and interconnection technology for high-temperature bulk acoustic wave resonators

Fabian Kohler, Monika Farina, Michal Schulz, Holger Fritze, and Jürgen Wilde

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Cited articles

Alley, G.: Interdigital capacitors and their application to lumped-element microwave integrated circuits, IEEE T. Microwave Theory Tech., MTT-18, 12, https://doi.org/10.1109/TMTT.1970.1127407, 1970. 
Bahl, I.: Lumped elements for RF and microwave circuits, Artech House, ISBN 978-1580533096, 2003. 
Bernhardt, G., Silvestre, C., Lecursi, N., Moulzolf, s. c., Frankel D. J., and Lad, R. J.: Performance of Zr and Ti adhesion layers for bonding of platinum metallization to sapphire substrates, Sensor. Actuat. B-Chem., 77, 368–374, 2001. 
Damjanovic, D.: Materials for high temperature piezoelectric transducers, Curr. Opin. Solid St. M., 3, 469–473, https://doi.org/10.1016/j.proeng.2016.11.322, 1998. 
Department of defense test method standard: Microcircuits, https://www.jedec.org/taxonomy/term/2754, last access: 18 March 2022. 
Short summary
This work shows a possibility of assembly and connection technology for use under high temperatures up to 1000 °C. A packaging concept was developed, and all the necessary material and joining technologies have been verified to be suitable for use at 1000 °C. A working sensor was built and measured in comparison to the resonator alone. All packaging materials and structures were measured electrically and dielectrically. Equivalent circuits for the packages up to 2 MHz and 1000 °C are available.