Journal of Sensors and Sensor Systems
Journal of Sensors and Sensor Systems
JSSS
Articles | Volume 15, issue 2
Articles | Volume 15, issue 2
https://doi.org/10.5194/jsss-15-167-2026
© Author(s) 2026. This work is distributed under
the Creative Commons Attribution 4.0 License.
https://doi.org/10.5194/jsss-15-167-2026
© Author(s) 2026. This work is distributed under
the Creative Commons Attribution 4.0 License.
Articles | Volume 15, issue 2
Regular research article
 | 
02 Sep 2026
Regular research article |  | 02 Sep 2026

Modeling and extraction of residual stresses in some MEMS multilayer systems

Li Long, Frank Long, Bernhard Schwartz, Geert Brokmann, and Thomas Ortlepp

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Short summary
Thin-film multilayers deposited on a wafer induce bending due to residual and thermal stresses that strongly depend on process conditions. The resulting curvature can be measured optically. We present a closed-form analytical model that relates the measured curvature to the residual stresses in individual layers. Using a small set of curvature measurements, layer-resolved residual stresses can be extracted without resource-intensive finite-element model simulations.
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