Articles | Volume 15, issue 2
https://doi.org/10.5194/jsss-15-167-2026
© Author(s) 2026. This work is distributed under the Creative Commons Attribution 4.0 License.
Modeling and extraction of residual stresses in some MEMS multilayer systems
Cited articles
Abadias, G., Chason, E., Keckes, J., Sebastiani, M., Thompson, G. B., Barthel, E., Doll, G. L., Murray, C. E., Stoessel, C. H., and Martinu, L.: Review Article: Stress in thin films and coatings: Current status, challenges, and prospects, J. Vac. Sci. Technol. A., 36, 020801, https://doi.org/10.1116/1.5011790, 2018. a
Chason, E., Shin, J. W., Heame, S. J., and Freund, L. B.: Kinetic model for dependence of thin film stress on growth rate, temperature, and microstructure, J. Appl. Phys., 111, 083520, https://doi.org/10.1063/1.4704683, 2012. a
Chason, E., Engwall, A. M., Rao, Z., and Nishimura, T.: Kinetic model for thin film stress including the effect of grain growth, J. Appl. Phys., 123, 185305, https://doi.org/10.1063/1.5030740, 2018. a, b, c
Chen, K. S., Zhang, X., and Lin, S. Y.: Intrinsic stress generation and relaxation of plasma-enhanced chemical vapor deposited oxide during deposition and subsequent thermal cycling, Thin Solid Films, 434, 190–202, https://doi.org/10.1016/S0040-6090(03)00462-0, 2003. a
Cowan, G.: Statistical Data Analysis, Oxford University Press, ISBN 0-19850156-0, 1998. a