Articles | Volume 5, issue 1
Regular research article
09 Mar 2016
Regular research article |  | 09 Mar 2016

Joining technologies for a temperature-stable integration of a LTCC-based pressure sensor

J. Schilm, A. Goldberg, U. Partsch, W. Dürfeld, D. Arndt, A. Pönicke, and A. Michaelis

Abstract. Besides the well-known application as circuit boards and housings, multilayer low-temperature co-fired ceramics (LTCC) offer a flexible and temperature-stable platform for the development of complex sensor elements. Commercial LTCC qualities are usually available with a matching set of metallization pastes which allow the integration of various electrical functions. However, for the integration of ceramic sensor elements based on LTCC into standardized steel housings it is necessary to compensate the mismatching thermal expansion behaviour. Therefore balancing elements made of Kovar® (Fe–29 wt% Ni–17 wt% Co) and alumina ceramic (Al2O3) can be used. These components have to be joined hermetically to each other and to the LTCC sensors. In this study, brazing experiments were performed for combinations of Kovar–Al2O3 and Kovar–LTCC with Ag–Cu–Ti- and Ag–Cu–In–Ti-based commercial braze filler metals, Cusil-ABA® and Incusil®-ABA, respectively. For both active braze filler metals, optimized processing parameters were investigated to realize hermetic Kovar–Al2O3 and Kovar–LTCC joints.