Articles | Volume 5, issue 1
J. Sens. Sens. Syst., 5, 73–83, 2016

Special issue: High-temperature sensors and materials

J. Sens. Sens. Syst., 5, 73–83, 2016

Regular research article 09 Mar 2016

Regular research article | 09 Mar 2016

Joining technologies for a temperature-stable integration of a LTCC-based pressure sensor

J. Schilm et al.

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Cited articles

Arróyave, R. and Eagar, T. W.: Metal substrate effects on the thermochemistry of active brazing interfaces, Acta Mater., 51, 4871–4880, 2003.
Berry, K. A.: Corrosion Resistance of military microelectronics package at the lead-glass interface, in: Proceedings of the ASM's 3rd Conference on Electronic Packaging: Materials and Corrosion in Microelectronics, Minneapolis, MN, Materials Park, OH, ASM International, 28–30 April 1987, 55–61, 1987.
Fernie, J. A., Drew, R. A. L., and Knowles, K. M.: Joining of engineering ceramics, Int. Mater. Rev., 54, 283–331, 2009.
Fournier, Y., Maeder, T., Boutinard-Rouelle, G., Barras, A., Craquelin, N., and Ryse, P.: Integrated LTCC pressure flow temperature multisensor for compressed air diagnostics, Sensors, 10, 11156–11173, 2010.
Hahn, S., Kim, M., and Kang, S.: A study of the reliability of brazed Al2O3 joint systems, IEEE Trans. Comp. Pack. Manuf. Tech. C., 21, 211–216, 1998.