Journal of Sensors and Sensor Systems
Journal of Sensors and Sensor Systems
JSSS
Articles | Volume 15, issue 1
Articles | Volume 15, issue 1
https://doi.org/10.5194/jsss-15-9-2026
© Author(s) 2026. This work is distributed under
the Creative Commons Attribution 4.0 License.
Special issue:
https://doi.org/10.5194/jsss-15-9-2026
© Author(s) 2026. This work is distributed under
the Creative Commons Attribution 4.0 License.
Articles | Volume 15, issue 1
Regular research article
 | 
08 Jan 2026
Regular research article |  | 08 Jan 2026

Automated contactless characterization of local thin film thickness and film stress with standard MEMS structures at wafer level

Dominik Huber, Christoph Schallert, Andre Gesing, Doris Steinmüller-Nethl, Georg Pfusterschmied, and Ulrich Schmid

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Short summary
We present an automated, contactless method to map thin film thickness and stress across microelectromechanical systems (MEMS) wafers. Using white light interferometry on cantilevers and step profiles, we extract both mean and gradient stress with orientation sensitivity. Applied to six thin films, the approach reveals process-dependent variations, offering a reliable tool for evaluating and comparing MEMS materials and fabrication methods.
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