Articles | Volume 15, issue 1
https://doi.org/10.5194/jsss-15-9-2026
© Author(s) 2026. This work is distributed under the Creative Commons Attribution 4.0 License.
Special issue:
Regular research article
| 
08 Jan 2026
Regular research article |
| 08 Jan 2026
| 08 Jan 2026
Automated contactless characterization of local thin film thickness and film stress with standard MEMS structures at wafer level
Related authors
J. Sens. Sens. Syst., 14, 89–98, 2025
Cited articles
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Baryshev, S. V., Erck, R. A., Moore, J. F., Zinovev, A. V., Tripa, C. E., and Veryovkin, I. V.: Characterization of surface modifications by white light interferometry: applications in ion sputtering, laser ablation, and tribology experiments, J. Vis. Exp., e50260, https://doi.org/10.3791/50260, 2013. a
Bhatt, G., Manoharan, K., Chauhan, P. S., and Bhattacharya, S.: MEMS Sensors for Automotive Applications: A Review, Springer Singapore, Singapore, 223–239, ISBN 978-981-13-3290-6, https://doi.org/10.1007/978-981-13-3290-6_12, 2019. a
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Bosseboeuf, A. and Petitgrand, S.: Application of microscopic interferometry techniques in the MEMS field, in: vol. 5145 of Optical Metrology, SPIE, https://doi.org/10.1117/12.500134, 2003. a
