Articles | Volume 13, issue 1
https://doi.org/10.5194/jsss-13-123-2024
© Author(s) 2024. This work is distributed under the Creative Commons Attribution 4.0 License.
Special issue:
Regular research article
| 
04 Jun 2024
Regular research article |
| 04 Jun 2024
| 04 Jun 2024
Integration and evaluation of the high-precision MotionCam-3D into a 3D thermography system
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Cited articles
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Bin, Z., Jianxin, Q., Yunkang, S., Wentao, H., and Longqiu, L.: In situ monitoring of flip chip package process using thermal resistance network method and active thermography, Int. J. Heat Mass Tran., 225, 125402, https://doi.org/10.1016/j.ijheatmasstransfer.2024.125402, 2024. a
Campione, I., Lucchi, F., Santopuoli, N., and Seccia, L.: 3D Thermal Imaging System with Decoupled Acquisition for Industrial and Cultural Heritage Applications, Appl. Sci., 10, 828, https://doi.org/10.3390/app10030828, 2020. a
Costanzo, A., Minasi, M., Casula, G., Musacchio, M., and Buongiorno, M.: Combined Use of Terrestrial Laser Scanning and IR Thermography Applied to a Historical Building, Sensors, 15, 194–213, https://doi.org/10.3390/s150100194, 2014. a, b
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