Articles | Volume 5, issue 1
J. Sens. Sens. Syst., 5, 197–203, 2016
https://doi.org/10.5194/jsss-5-197-2016

Special issue: Dresden Sensor Symposium 2015

J. Sens. Sens. Syst., 5, 197–203, 2016
https://doi.org/10.5194/jsss-5-197-2016

Regular research article 08 Jun 2016

Regular research article | 08 Jun 2016

Offset stable piezoresistive high-temperature pressure sensors based on silicon

Robert Täschner et al.

Related subject area

Sensor principles and phenomena: Mechanical and inertial sensors
Creep adjustment of strain gauges based on granular NiCr-carbon thin films
Maximilian Mathis, Dennis Vollberg, Matthäus Langosch, Dirk Göttel, Angela Lellig, and Günter Schultes
J. Sens. Sens. Syst., 10, 53–61, https://doi.org/10.5194/jsss-10-53-2021,https://doi.org/10.5194/jsss-10-53-2021, 2021
Short summary
A tactile sensor based on magneto-sensitive elastomer to determine the position of an indentation
Simon Gast and Klaus Zimmermann
J. Sens. Sens. Syst., 9, 319–326, https://doi.org/10.5194/jsss-9-319-2020,https://doi.org/10.5194/jsss-9-319-2020, 2020
Short summary
Novel method to reduce the transverse sensitivity of granular thin film strain gauges by modification of strain transfer
Maximilian Mathis, Dennis Vollberg, Matthäus Langosch, Dirk Göttel, Angela Lellig, and Günter Schultes
J. Sens. Sens. Syst., 9, 219–226, https://doi.org/10.5194/jsss-9-219-2020,https://doi.org/10.5194/jsss-9-219-2020, 2020
Short summary
Multi-parameter sensing using thickness shear mode (TSM) resonators – a feasibility analysis
Manfred Weihnacht
J. Sens. Sens. Syst., 8, 133–147, https://doi.org/10.5194/jsss-8-133-2019,https://doi.org/10.5194/jsss-8-133-2019, 2019
Short summary
Cylinder pressure sensors for smart combustion control
Dennis Vollberg, Dennis Wachter, Thomas Kuberczyk, and Günter Schultes
J. Sens. Sens. Syst., 8, 75–85, https://doi.org/10.5194/jsss-8-75-2019,https://doi.org/10.5194/jsss-8-75-2019, 2019
Short summary

Cited articles

Blech, M., Übensee, H., Täschner, R., Brokmann, G., Xu, X., and Ortlepp, T.: Zeitkonstanten für die Relaxation thermomechanischer Spannungen in Silizium-Glas, 6th Mikrosystemtechnik-Kongress, 26–28 October 2015, Karlsruhe, Germany, 2015.
Bring, M.: Method for measuring fracture toughness of wafer-bonded interfaces with high spatial resolution, J. Micromech. Microeng., 16, S68–S74, 2006.
Burns, D. W.: “Micromechanical integrated sensors and the planar processed pressure transducer”, PhD work, University of Wisconsin, Madison, WI, USA, 1988.
Celler, G. K. and Cristoloveanu, S.: Frontiers of silicon-on-insulator, J. Appl. Phys., 93, 4955–4978, 2003.
Chung, G. S.: Fabrication and Characterization of a Polycrystalline 3C-SiC Piezoresistive Micro-pressure Sensor, J. Korean Phys. Soc., 56, No. 6, 1759–1762, 2010.
Download
Short summary
The exploitation of new application fields and the drive to size reduction even in highly stable pressure sensing systems makes the extension of the operating temperature range of the microelectromechanical sensors (MEMS) essential. For this reason, a silicon-based pressure sensor with an application temperature ranging up to 300 °C and the associated manufacturing technology was developed. The evolved sensor has an excellent stability and is uncomplicated to mount due to its stress insensitivity.