Articles | Volume 12, issue 1
https://doi.org/10.5194/jsss-12-69-2023
© Author(s) 2023. This work is distributed under
the Creative Commons Attribution 4.0 License.
the Creative Commons Attribution 4.0 License.
https://doi.org/10.5194/jsss-12-69-2023
© Author(s) 2023. This work is distributed under
the Creative Commons Attribution 4.0 License.
the Creative Commons Attribution 4.0 License.
Gauge to simultaneously determine the electrical conductivity, the Hall constant, and the Seebeck coefficient up to 800 °C
Robin Werner
Department of Functional Materials, University Bayreuth, 95447
Bayreuth, Germany
Jaroslaw Kita
Department of Functional Materials, University Bayreuth, 95447
Bayreuth, Germany
Michael Gollner
Linseis Thermal Analysis, 95100 Selb, Germany
Florian Linseis
Linseis Thermal Analysis, 95100 Selb, Germany
Ralf Moos
CORRESPONDING AUTHOR
Department of Functional Materials, University Bayreuth, 95447
Bayreuth, Germany
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Differential scanning calorimetry (DSC) is a widely used tool to analyze thermal material properties. This study focuses on the advancement of a miniaturized DSC chip as an alternative to conventional devices. The first development steps for the integration of a weighing system are shown, starting with model considerations and simulation-based optimization to initial measurements. Three different measurement methods are investigated and show promising results.
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Short summary
A high-temperature gauge to simultaneously determine electrical conductivity, the Hall constant, and the Seebeck coefficient was developed. Screen-printed heating structures on a ceramic sample holder generate temperatures up to 800 °C. Heating structures were designed using FEM simulations. The temperature distribution was validated by thermal imaging. Measurements on constantan (reference material) and boron-doped silicon wafer confirm the functionality of the gauge up to 800 °C.
A high-temperature gauge to simultaneously determine electrical conductivity, the Hall constant,...